Ductile-regime turning of germanium and silicon

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National Aeronautics and Space Administration , [Washington, DC
Germanium -- Ductility., Silicon -- Ducti
Other titlesDuctile regime turning of germanium and silicon.
Statementby Peter N. Blake and Ronald O. Scattergood.
SeriesNASA-TM -- 101231., NASA technical memorandum -- 101231.
ContributionsScattergood, Ronald O., United States. National Aeronautics and Space Administration.
The Physical Object
Pagination1 v.
ID Numbers
Open LibraryOL17659676M

Precision machining of germanium and silicon was studied using single-point diamond turning. Special attention was directed to the so-called ductile.

Get this from a library. Ductile-regime turning of germanium and silicon. [Peter N Blake; Ronald O Scattergood; United States. National Aeronautics and Space Administration.].

SiC experiences a ductile-to-brittle transition similar to other nominally brittle materials such as silicon, germanium, and silicon nitride. It is believed that the ductility of SiC during machining is due to the formation of a high-pressure phase at the cutting edge, which encompasses the chip formation zone and its associated material by: Ductile-regime response during the diamond turning of brittle germanium crystals is evident from the damage-free surfaces obtained.

The nature of the ductile-regime processes cannot be determined by examination of the final machined surface itself. Machining chips were characterized using scanning electron by: In book: Ductile Mode Cutting of Brittle Materials (pp) Ductile-regime turning of germanium and silicon Single-point diamond turning.

Peter N. Blake has written: 'Ductile-regime turning of germanium and silicon' -- subject(s): Ductility, Germanium, Silicon. Peter N. Blake has written: 'Ductile-regime turning of germanium and silicon' -- subject(s): Ductility, Germanium, Silicon Asked in Authors, Poets, and Playwrights What has the author F.

Germanium recycling in the United States in [electronic resource] / by John D. Jorgenson; Ductile-regime turning of germanium and silicon [microform] / by Peter N. Blake and Ronald O. Scattergood; Neutron energy determination with a high-purity germanium detector [microform] /.

: Skip to main content. Try Prime All Go Search EN Hello, Sign in Account & Lists Sign in Account & Lists Orders Try Prime Cart. It may help to choose and/or optimize conditions of ductile-regime machining of semiconductors, as well as give new insights into their surface properties.

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Information on the phase transformations in the surface layer of materials resulting from contact interactions is important for understanding the mechanisms of wear, friction and by: INTRODUCTION Ductile machining of brittle materials such as silicon, germanium, glass and ceramics is now recognized as an emerging technology with important applications.

It is normally realized by keeping the depth of cut and the feed rate below certain critical values [].Author: Toshimichi Moriwaki, Eiji Shamoto. Morris JC, Callahan DL, Kulik J, Patten JA and Scattergood RO (). Origins of the Ductile Regime in Single-Point Diamond Turning of Semiconductors. Journal of the American Ceramic.

Society. 78(8): – CrossRef Google Scholar. Ductile-regime grinding principle When machined, a brittle material can deform via a variety of mechanisms. If the critical resolved shear stress at any point within the material exceeds the elastic yield stress, the mechanism of deformation will change from one of reversible energy storage via elastic stretching to one of irreversible energy.

Ductile cutting are most widely used in fabricating high-quality optical glass components to achieve crack-free surfaces. For ultra-precision machining of brittle glass materials, critical undeformed chip thickness (CUCT) commonly plays a pivotal role in determining the transition point from ductile cutting to brittle cutting.

In this research, cutting characteristics in nanometric Cited by: 7. Precision glass molding is a promising method in the large-scale industrial production of lenticular lenses.

Single crystal silicon is an important mold material used in the precision glass molding industry due to its high thermal stability and available processing methods [3,4,5].However, silicon is a brittle material that is relatively difficult to cut using a diamond tool because cracks are Cited by: 1.

The ductile ultrasonic vibration cutting of glasses was conducted by the same experimental setup shown in Figure this experiment, a different ultraprecision lathe with a spindle and a table supported by air bearings was employed with the vibration tool shown in Figure spindle is rotated by an air turbine, and the table is driven by a DC servo motor via a steel wire.

Description Ductile-regime turning of germanium and silicon PDF

The brittle materials such as glasses, silicon, and germanium are machined with high-speed ultra-precision lathe to understand the material removal mechanism in different modes.

When the applied depth of cut is below the critical value, it is considered to be in the ductile mode, and it can be easily machined without crack : P. Suya Prem Anand. The concept of ductile-regime machining has been investigated since s for amorphous brittle materials such as glasses.

Silicon, germanium, and glasses have become strategic materials that are widely used to fabricate intricate components in microelectronics, optics, defense industries, and recently as micro optical-electrical-mechanical Author: Wayne N.P.

Hung, Mike Corliss. When machining silicon at similar removal rates, as with germanium, tool life was found to be less than 8 kilometers. The surface finish quality was also on the order of 1 nm Ra.

Tool life was higher, when machining zinc sulphide, being in excess of 20 kilometers, although the surface quality was lower, with a roughness value of nm Ra. KEYWORDS: Diamond turning, Diamond, Solar concentrators, Diamond machining, Lenses, Solar cells, Manufacturing, Fresnel lenses, Optics manufacturing, Surface finishing Read Abstract + Radial and Linear Fresnel Lenses are finding application as light concentrators for Concentrated Photovoltaic and Concentrated Solar Thermal power applications.

SPIE Digital Library Proceedings. Proc. SPIEMicromachining of Elements with Optical and Other Submicrometer Dimensional and Surface Specifications, pg (11 January ); doi: / Full text of "Optical Design Fundamentals For Infrared Systems (3)" See other formats.

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Two novel techniques were used to study the formation of ductile mode streaks during diamond grinding (primary process) of germanium, silicon, and glass. In the first technique, aspheric surfaces were generated on Ge and Si at conventional speeds ( rpm).

Full text of "Machining of advanced materials" See other formats. Download Solutions Manual - Materials Processing in Manufacturing Demargo. Silicon, pulsed water drop micromachining,Silicon carbide, Silicon germanium blend, 7 Silicon wafers, 1 2 Silva studies, Si/Mo substrate, Simulation,see also Modeling Single degree of freedom (SDOF) curve fit, Single layer absorber fabrication, 44 45 Single point diamond turning,5.

(a) Measurement of cutting forces in turning process using dynamometers. (b) Experiment on lathe: Facing, plain turning, step turning and parting - groove cutting, knurling and chamfering - form turning and taper turning - eccentric turning.

(c) Measurement of flank wear in turning process using tool makers microscope. - 3 practices. Usually, hard and brittle materials such as glass, silicon, zirconium oxide, aluminum oxide, PZT ceramics and germanium are commonly used for making these products.

The advances on micro grinding of brittle materials have led to the discovery of a ductile regime in which material removal is performed by plastic deformation. Modelling of Material Side Flow in Hard Turning: H.A. Kishawy (2), A.

Haglund, M. Balazinski (1) STC C, 55/1/, P Keywords: Turning, Modelling, FEM: Abstract: In this paper an attempt has been made to model the material side flow generated during hard turning operation.

A three dimensional thermo elasto-viscoplastic finite element. ISSN ISSN (Online) CN /TH. Postal Subscription Code Impact Factor: Cited by: 2.

The author’s success with the publication of his first book Experimental techniques in metal cutting infollowed by a 2nd Edition in strengthened his resolve to write on precision engineering. This book is divided into eight chapters: Chapter 1 is .Blake and Scattergood [BLA 90], who studied the precision machining of germanium and silicon using single-point diamond turning, pointed out that the critical underformed chip thickness is a pivotal parameter, which governs the transition from plastic flow to fracture along the tool nose.1 Introduction Single Point Diamond Turning (SPDT) is a machining process first developed for the production of optical components of ductile materials, such as aluminium and copper.

This technology evolved to brittle materials in the optical and electronic industry to produce surfaces with form accuracy of the order of micrometers and roughness of the order of nanometers.